AMD Opteron ™ 6300 Series Prosesor

Get the performance you need at the price you want for the current workload demands. AMD Opteron ™ 6300 Series processors deliver the performance for the real world and real budget value by offering low-cost acquisition which helps to reduce the overall TCO. What's more, the new enhancements allow applications to run faster over the previous generation while staying within the same power budget.

Achievement	Characteristic	Function	Benefits
	The second generation AMD core modular architecture - codenamed "Piledriver"	Higher performance and higher performance / watt than the previous generation. Same band power and power-saving features. Socket compatible.	Provide improved TCO with higher performance and better price / performancefrom the previous generation. Provide improved power efficiency with run applications faster while staying in within the same power budget.  Extend the life of the investment by leveraging current socket platform.
	Cache and Core Count	Up to 16 cores in the same package, 1MB L2 cache per core (up to 16MB of L2 cache per socket), and a 16MB shared L3 cache per socket .	Offers improved performance and performance / watt (compared to prior generations) for multithreaded environments like virtualization, database and web serving .
	DDR3 High Frequency	DDR3-1600 are supported for a typical memory configuration, DDR3-1866 memory configurations are supported in a bit loaded.	Helping to improve overall system performance.
	Quad Channel Memory	Four-channel DDR3 memory with a max memory bandwidth up to 51.2 GB / s @ DDR3-1600 RDIMM with, LRDIMM, RDIMM and UDIMM LV.	Can improve performance, especially in memory-intensive workloads.
	AMD Turbo CORE Technology	AMD Turbo CORE technology helps improve performance by enabling all the cores to improve performance up to 300MHz simultaneously when the headroom available .	An additional advantage of clock speed to enhance performance .
	AES instructions	Providing hardware acceleration to enable fast and secure data encryption and decryption .	Realize improved application performance .
	TDP Power Cap	Thermal design power (TDP) can be set up in a phased watt using BIOS or APML so customers can "dial" their server power load to get the most processing power into a single rack, maximizing the power budget.	Get more flexible, dense deployment, translating into more servers in a rack.
	C6 State Electricity	The core power gating: Each module can enter the C6 which is stored into DRAM module and voltage gated off entirely. This allows other modules to increase the frequency.	Get reducing energy costs during low usage .
AMDP2.0	APML (Advanced Platform Management Link)	Provides an interface for processor and systems management monitoring and controlling system resources (in APML-enabled platforms); Consists of Remote Power Management Interface (RPMI) and Precision Thermal Monitor.	Remotely monitor and control power and cooling.
	AMD Cool Speed ​​Tecnology	Allows the server to automatically fall into the low-power mode if the processor thermal environment exceeds safe operational limits and offer platform providers the ability to safely reduce speed fan system, which helps provide greater efficiency platform.	Help protect the processor from overheating.
	C1E	Reducing the power just outside the processor.	Reducing the memory controller and HyperTransport ™ technology link power '.
	LV-DDR3 Support	Supports DDR3 in addition to 1.35V 1.25V.	Helping to reduce the overall power consumption .
	LR-DIMM Support	Allows very dense memory configurations.	Help reduce the memory bottleneck in a memory-intensive applications such as virtualization..
Direct Connect Architecture 2.0	HyperTransport ™ Technology Assist (HT Assist)	Helps to increase coherent memory bandwidth and reduces the latency in multi-nodesystems by reducing cache probe traffic between cores.	Improving the efficiency of the server and scalability by helping to reduce cache probe traffic bus .
	HyperTransport ™ 3,0 Tecnology (HT3)	Provides superior system bandwidth between the CPU and I / O, increased levels of interconnection to a maximum 6.4GT / s with HT3.	Help improve overall system balance and scalability.
AMD-V ™ 2.0 Technology	AMD Virtualization ™ (AMD-V ™) 2.0 Tecnology	Tagged TLB - Efficient switching between virtual machines for better application responsiveness.  Quickly Virtualization Indexing - Hardware-based virtual machine memory management.  AMD-V ™ Extended Migration Technology - Helps enable live migration of VMs between all available AMD Opteron ™ processor generation.  I / O Virtualization - Allows direct access to the virtual machines to increase the integrity and security.	Easy to deploy - a large pool of resources enables greater VM consolidation. Easy to manage - the general architecture makes managing virtual pool easily. Easy to move - extended migration provides great flexibility for load balancing and disaster recovery.

AMD Opteron ™ 6300 Series Prosesor
Model Number	Cores	Core Speed	AMD Turbo CORE Max Frequency	L3 Cache	TDP	Socket Type
6386 SE	16	2.8GHz	3.5GHz	16MB	140W	G34
6380	16	2.5GHz	3.4GHz	16MB	115W	G34
6378	16	2.4GHz	3.3GHz	16MB	115W	G34
6376	16	2.3GHz	3.2GHz	16MB	115W	G34
6348	12	2.8GHz	3.4GHz	16MB	115W	G34
6344	12	2.6GHz	3.2GHz	16MB	115W	G34
6328	8	3.2GHz	3.8GHz	16MB	115W	G34
6320	8	2.8GHz	3.3GHz	16MB	115W	G34
6308	4	3.5GHz	N / A	16MB	115W	G34
6366 HE	16	1.8GHz	3.1GHz	16MB	85W	G34