AMD Opteron ™ 6200 Series Processor - Features and Benefits

This article is a continuation post on 16 November. Based on the attached chart you can compare the similarities and differences between the AMD Opteron AMD Opteron 6100 and AMD Opteron 6200.

FEATURE	FUNCTION	END USER BENEFITS
Core Architecture	Optimized performance per watt:  Full performance of each core  High-frequency and low-power design  Virtualization enhancements  Together with double-sized Flex FP  Additional ISA	New processor core to improve power efficiency for server products: Helps reduce the complexity of cooling solutions Helps reduce power at low utilization Enable more control for IT managers
AMD Turbo CORE Technology	Apparently unused headroom TDP to clock speed added to improve performance	The industry's best full-core increases with increasing frequency from 1 to 500MHz2
Additional ISA	In addition to the basic support instruction, added SSE4.1, SSE4.2, SSSE3, AVX, AES, PCLMULQDQ, FMA4 and XOP	Provides improved performance for a variety of applications
Flex FP	World's only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for a dedicated 128-bit execution per core or shared 256-bit execution per module.	Increase flexibility and performance technical computing

AMD-P 2.0

FEATURE	FUNCTION	END USER BENEFITS
APML (Advanced Platform Management Link)	Provides the interface for processor and systems management monitoring and controlling system resources (in APML-enabled platforms); Consists of Remote Power Management Interface (RPMI) and Precision Thermal Monitor	Remote Power Management Interface (RPMI):  The ability to monitor and control platform power consumption via p-state limits Access to processor identification and health Precision Thermal Monitor: Provide accurate information about the CPU to monitor thermal power / cooling and proactively remind Base Management Controller (BMC) Notification early helps save time and money by providing intelligence that can be used to more effectively monitor power and thermal cooling solutions for optimizing the IT datacenter
TDP Power Cap	Allows the user to set a maximum limit of processing power via the BIOS or APML	This technology gives companies the ability to customize their chips to meet power and workload demands, providing: More control over power settings Flexibility to set power limits without capping the CPU frequency
AMD Cool Speed ​​Technology	Protecting the integrity of the processor to reduce the power of the state, when the temperature limit is reached	Server can automatically fall into the low-power mode if the processor thermal environment exceeds safe operational Offering platform providers the ability to safely reduce speed fan system, which helps provide greater efficiency platform
C1E	Reducing the memory controller and HyperTransport ™ technology link power '	This feature can equate to significant electricity savings in your datacenter depending on system configuration, when the Northbridge and HyperTransport ™ technology links are turned off and the core is at idle.
C6 Support	Core power gating: When the core is stopped context exported to the system memory and the voltage is removed from the core.	Helps reduce power consumption at idle by 46% over the previous generation 3
LV-DDR3 Support	Supports 1.25V and 1.35V DDR3	Helping to reduce the overall power consumption
DDR3 High Frequency	DDR3-1600 are supported for a typical memory configuration, DDR3-1866 memory configurations are supported in a slightly loaded (1 of 1 DIMM per channel)	Helps to improve the overall system performance
LR-DIMM Support	Support for LR-DIMM Memory	LR-DIMM provide more capacity per DIMM, which can allow memory server configuration higher overall. Virtualization, cloud computing and other high-capacity applications greatly benefit from the LR-DIMM.

Direct Connect Architecture 2.0

FEATURE	FUNCTION	END USER BENEFITS
Quad Channel Memory	Doubles memory channels compared to Six-Core AMD Opteron ™ processors	Can improve performance, especially in memory-intensive workloads
HyperTransport ™ Technology Assist (HT Assist)	Helps to increase coherent memory bandwidth and reduces the latency in multi-node systems by reducing cache probe traffic between the core	Can result in faster query can increase performance for cache sensitive applications such as database, virtualization, and compute intensive applications
HyperTransport ™ 3.0 technology (HT3)	Provides superior system bandwidth between the CPU and I / O, increased levels of interconnection to a maximum 6.4GT / s with HT3	Help improve overall system balance and scalability for scale-out computing environments such as HPC, database and web serving
Cache and Core Count	Integration up to 16 cores in the same package, 1MB L2 cache per core (up to 16MB of L2 cache per socket), and a 16MB L3 cache shared per socket	Offers improved performance and performance / watt (compared to prior generations) for multithreaded environments like virtualization, database and web serving

1.      Compared with Intel Turbo Boost which reaches up to an increase in the frequency of 266MHz. See http://ark.intel.com/products/47925/Intel-Xeon-Processor-E5620 #infosectionessentials
2.       2. Based on internal AMD engineering projections AMD Opteron 6200 Series processors with up to 500MHz in the 1.3GHz increase in P1 and P0 to increase the frequency of the P2-hour basis
3.       3. Based on testing at AMD Performance Labs in August 2011, an AMD Opteron ™ processor Model 6174 (12-core 2.2GHz) consumes 11.7W in the active idle C1E power while the AMD Opteron ™ processor Model 6276 (16-core 2.3 GHz) consumes only 6.4 W in the active idle C1E power with the new C6 power gating employed. System configuration: "dram" reference design kit, 32GB (8 x 4GB DDR3-1333) memory, 500GB SATA disk drive, Microsoft ® Windows Server ® 2008 R2 x64 Enterprise Edition. SVR-60