November 30, 2012

FLEXIBLE GADGETS


Imagine if you could treat your phone like a piece of paper. Rolled, dropped, tucked into a backpack, or trampled but still not broken. How is it possible? How can a cell phone screen be twirled up like a Fruit Roll Up and then folded in the middle up to become a video conferencing stand?

www.lazada.com
Wait until 2013. You will see the gadgets that are not only smart but also flexible. Gadgets brings new technology, namely Organic Lights Emitting Diode (OLED). -OLED is a semiconductor that emits light flexible technology. Previous technologies have been applied to the lighting. OLED lighting panels are made of a thin film of material that emit bright light desirable. OLEDs can be color-tunable, flexible or even transparent. OLED technology provides for higher efficiency than today's standard lighting. With no mercury and low power consumption OLED is the next evolution in lighting for a greener planet.

Prototype has been there and attract a lot of attention in a variety of technology equipment exhibition. Next year we have seen the launch of mobile phone that can be bent for the first time. Various companies, including LG, Philips, Sharp, Sony and Nokia, are developing the technology. Samsung will be the first company to make it happen. Samsung will be the first company to make it happen.
The screen will be "folded, rolled and more, and enables high durability through the use of plastic coating that is thinner, lighter and more flexible than conventional LCD technology ...," said a spokesman for Samsung.

But there are many other technologies that can make your smart phone can be bent or curved. However, the concept of creating a flexible and assemble electronics on flexible plastic that also has been discussed since the 1960s. And in 2005, Philips demonstrated the first prototype of the display that can be rolled.

OLED TECHNOLOGY
OLED technology is an important tool in elektroluminensi. These technologies have the basic concept of the light beam generated by the device due to the applied electric field. OLED technology was developed to obtain a broad view, flexible, inexpensive and can be used as an efficient screen display for different purposes.
Number of colors of light emitted by the OLED devices evolve from one color to multi-color. This phenomenon is obtained by varying the voltage that is supplied to the OLED device so that the device has the prospect of becoming an alternative devices such as flat-screen display technology based on liquid crystals.
OLED structure consists of layers made ​​of glass-indium tin oxide that serves as the positive electrode or anode, organic layers of aromatic diamine with a thickness of 750 nm, the light emitting layer made ​​of metal complex compounds such as 8-hydroxyquinoline aluminum, and a negative electrode layer or cathodes made ​​from an alloy of magnesium and silver by atomic ratio 10:1. Construction of the entire layer is not more than 500 nm, meaning same thin OLED with a sheet of paper.
An important part of the OLED device is an electrode layer and a thin layer consisting of organic molecules as light-emitting both of which are arranged overlapping. The organic layer can be deposited with a relatively simple technique that plays coating (spin coating) while the electrode layer is deposited using evaporation techniques (evaporation). Electrode layers made ​​of metal or semi-transparent transparent as Indium Tin Oxide (ITO) or aluminum (Al). Properties of transparent allowing light from an optimal exit device structure.

November 28, 2012

AMD Opteron ™ 6300 Series Prosesor


Get the performance you need at the price you want for the current workload demands. AMD Opteron ™ 6300 Series processors deliver the performance for the real world and real budget value by offering low-cost acquisition which helps to reduce the overall TCO. What's more, the new enhancements allow applications to run faster over the previous generation while staying within the same power budget.

Achievement
Characteristic
Function
Benefits
The second generation AMD core modular architecture - codenamed "Piledriver"
  • Higher performance and higher performance / watt than the previous generation.
  • Same band power and power-saving features.
  • Socket compatible.
  • Provide improved TCO with higher performance and better price / performancefrom the previous generation.
  • Provide improved power efficiency with run applications faster while staying in within the same power budget.
  •  Extend the life of the investment by leveraging current socket platform.
Cache and Core Count
Up to 16 cores in the same package, 1MB L2 cache per core (up to 16MB of L2 cache per socket), and a 16MB shared L3 cache per socket .
Offers improved performance and performance / watt (compared to prior generations) for multithreaded environments like virtualization, database and web serving . 
DDR3 High Frequency
DDR3-1600 are supported for a typical memory configuration, DDR3-1866 memory configurations are supported in a bit loaded.
Helping to improve overall system performance.
Quad Channel Memory 
Four-channel DDR3 memory with a max memory bandwidth up to 51.2 GB / s @ DDR3-1600 RDIMM with, LRDIMM, RDIMM and UDIMM LV.
Can improve performance, especially in memory-intensive workloads.
AMD Turbo CORE Technology
AMD Turbo CORE technology helps improve performance by enabling all the cores to improve performance up to 300MHz simultaneously when the headroom available . 
An additional advantage of clock speed to enhance performance . 
AES instructions
Providing hardware acceleration to enable fast and secure data encryption and decryption . 
Realize improved application performance . 
TDP Power Cap
Thermal design power (TDP) can be set up in a phased watt using BIOS or APML so customers can "dial" their server power load to get the most processing power into a single rack, maximizing the power budget.
Get more flexible, dense deployment, translating into more servers in a rack.
C6 State Electricity
The core power gating: Each module can enter the C6 which is stored into DRAM module and voltage gated off entirely. This allows other modules to increase the frequency.
Get reducing energy costs during low usage . 
 AMDP2.0
APML (Advanced Platform Management Link)
Provides an interface for processor and systems management monitoring and controlling system resources (in APML-enabled platforms); Consists of Remote Power Management Interface (RPMI) and Precision Thermal Monitor.
Remotely monitor and control power and cooling.
AMD Cool Speed ​​Tecnology 
Allows the server to automatically fall into the low-power mode if the processor thermal environment exceeds safe operational limits and offer platform providers the ability to safely reduce speed fan system, which helps provide greater efficiency platform.
Help protect the processor from overheating.
C1E 
Reducing the power just outside the processor.
Reducing the memory controller and HyperTransport ™ technology link power '. 
LV-DDR3 Support
Supports DDR3 in addition to 1.35V 1.25V.
Helping to reduce the overall power consumption . 
LR-DIMM Support
Allows very dense memory configurations.
Help reduce the memory bottleneck in a memory-intensive applications such as virtualization..
Direct Connect Architecture 2.0
HyperTransport ™ Technology Assist (HT Assist) 
Helps to increase coherent memory bandwidth and reduces the latency in multi-nodesystems by reducing cache probe traffic between cores.
Improving the efficiency of the server and scalability by helping to reduce cache probe traffic bus . 
HyperTransport ™ 3,0 Tecnology (HT3) 
Provides superior system bandwidth between the CPU and I / O, increased levels of interconnection to a maximum 6.4GT / s with HT3.
Help improve overall system balance and scalability.
AMD-V ™ 2.0 Technology 
AMD Virtualization ™ (AMD-V ™) 2.0 Tecnology 
  • Tagged TLB - Efficient switching between virtual machines for better application responsiveness.
  •  Quickly Virtualization Indexing - Hardware-based virtual machine memory management.
  •  AMD-V ™ Extended Migration Technology - Helps enable live migration of VMs between all available AMD Opteron ™ processor generation.
  •  I / O Virtualization - Allows direct access to the virtual machines to increase the integrity and security.
  • Easy to deploy - a large pool of resources enables greater VM consolidation.
  • Easy to manage - the general architecture makes managing virtual pool easily.
  • Easy to move - extended migration provides great flexibility for load balancing and disaster recovery.

AMD Opteron ™ 6300 Series Prosesor
Model Number
Cores
 Core Speed
AMD Turbo CORE Max Frequency
L3 Cache
TDP
Socket Type
6386 SE
16
2.8GHz
3.5GHz
16MB
140W 
G34
6380
16
2.5GHz
3.4GHz
16MB
115W 
G34
6378
16
2.4GHz
3.3GHz
16MB
115W
G34
6376
16
2.3GHz
3.2GHz
16MB
115W
G34
6348
12
2.8GHz
3.4GHz
16MB
115W
G34
6344
12
2.6GHz
3.2GHz
16MB
115W
G34
6328
8
3.2GHz
3.8GHz
16MB
115W
G34
6320
8
2.8GHz
3.3GHz
16MB
115W
G34
6308
4
3.5GHz
N / A
16MB
115W
G34
6366 HE
16
1.8GHz
3.1GHz
16MB
85W
G34


November 25, 2012

AMD Opteron ™ 6200 Series Processor - Features and Benefits

This article is a continuation post on 16 November. Based on the attached chart you can compare the similarities and differences between the AMD Opteron AMD Opteron 6100 and AMD Opteron 6200.

FEATURE
FUNCTION
END USER BENEFITS
Core Architecture
Optimized performance per watt:
 Full performance of each core
 High-frequency and low-power design
 Virtualization enhancements
 Together with double-sized Flex FP
 Additional ISA
  • New processor core to improve power efficiency for server products:
  • Helps reduce the complexity of cooling solutions
  • Helps reduce power at low utilization

  • Enable more control for IT managers
AMD Turbo CORE Technology
Apparently unused headroom TDP to clock speed added to improve performance
The industry's best full-core increases with increasing frequency from 1 to 500MHz2
Additional ISA
In addition to the basic support instruction, added SSE4.1, SSE4.2, SSSE3, AVX, AES, PCLMULQDQ, FMA4 and XOP
Provides improved performance for a variety of applications
Flex FP
World's only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for a dedicated 128-bit execution per core or shared 256-bit execution per module.
Increase flexibility and performance technical computing



AMD-P 2.0

FEATURE
FUNCTION
END USER BENEFITS
APML (Advanced Platform Management Link)
Provides the interface for processor and systems management monitoring and controlling system resources (in APML-enabled platforms); Consists of Remote Power Management Interface (RPMI) and Precision Thermal Monitor
  • Remote Power Management Interface (RPMI):
  •  The ability to monitor and control platform power consumption via p-state limits
  • Access to processor identification and health


Precision Thermal Monitor:
  • Provide accurate information about the CPU to monitor thermal power / cooling and proactively remind Base Management Controller (BMC)
  • Notification early helps save time and money by providing intelligence that can be used to more effectively monitor power and thermal cooling solutions for optimizing the IT datacenter
TDP Power Cap
Allows the user to set a maximum limit of processing power via the BIOS or APML
This technology gives companies the ability to customize their chips to meet power and workload demands, providing:
  • More control over power settings
  • Flexibility to set power limits without capping the CPU frequency
AMD Cool Speed ​​Technology
Protecting the integrity of the processor to reduce the power of the state, when the temperature limit is reached
  • Server can automatically fall into the low-power mode if the processor thermal environment exceeds safe operational
  • Offering platform providers the ability to safely reduce speed fan system, which helps provide greater efficiency platform
C1E
Reducing the memory controller and HyperTransport ™ technology link power '
This feature can equate to significant electricity savings in your datacenter depending on system configuration, when the Northbridge and HyperTransport ™ technology links are turned off and the core is at idle.
C6 Support
Core power gating: When the core is stopped context exported to the system memory and the voltage is removed from the core.
Helps reduce power consumption at idle by 46% over the previous generation 3
LV-DDR3 Support
Supports 1.25V and 1.35V DDR3
Helping to reduce the overall power consumption
DDR3 High Frequency
DDR3-1600 are supported for a typical memory configuration, DDR3-1866 memory configurations are supported in a slightly loaded (1 of 1 DIMM per channel)
Helps to improve the overall system performance
LR-DIMM Support
Support for LR-DIMM Memory
LR-DIMM provide more capacity per DIMM, which can allow memory server configuration higher overall. Virtualization, cloud computing and other high-capacity applications greatly benefit from the LR-DIMM.


Direct Connect Architecture 2.0
FEATURE
FUNCTION
END USER BENEFITS
Quad Channel Memory
Doubles memory channels compared to Six-Core AMD Opteron ™ processors
Can improve performance, especially in memory-intensive workloads
HyperTransport ™ Technology Assist (HT Assist)
Helps to increase coherent memory bandwidth and reduces the latency in multi-node systems by reducing cache probe traffic between the core
Can result in faster query can increase performance for cache sensitive applications such as database, virtualization, and compute intensive applications
HyperTransport ™ 3.0 technology (HT3)
Provides superior system bandwidth between the CPU and I / O, increased levels of interconnection to a maximum 6.4GT / s with HT3
Help improve overall system balance and scalability for scale-out computing environments such as HPC, database and web serving
Cache and Core Count
Integration up to 16 cores in the same package, 1MB L2 cache per core (up to 16MB of L2 cache per socket), and a 16MB L3 cache shared per socket
Offers improved performance and performance / watt (compared to prior generations) for multithreaded environments like virtualization, database and web serving


1.      Compared with Intel Turbo Boost which reaches up to an increase in the frequency of 266MHz. See http://ark.intel.com/products/47925/Intel-Xeon-Processor-E5620 #infosectionessentials
2.       2. Based on internal AMD engineering projections AMD Opteron 6200 Series processors with up to 500MHz in the 1.3GHz increase in P1 and P0 to increase the frequency of the P2-hour basis
3.       3. Based on testing at AMD Performance Labs in August 2011, an AMD Opteron ™ processor Model 6174 (12-core 2.2GHz) consumes 11.7W in the active idle C1E power while the AMD Opteron ™ processor Model 6276 (16-core 2.3 GHz) consumes only 6.4 W in the active idle C1E power with the new C6 power gating employed. System configuration: "dram" reference design kit, 32GB (8 x 4GB DDR3-1333) memory, 500GB SATA disk drive, Microsoft ® Windows Server ® 2008 R2 x64 Enterprise Edition. SVR-60